Issue link: https://te.mouser.com/i/1410851
Level 1: Primary Element Connection Level—Basic connection to the primary electronic element. In the microprocessor area, this is typically a wire bond to the electronic die. Level 2: Component to Circuitry—Component lead to PCB trace. This is almost always a soldered joint used to connect an electronic device to a PCB. App Level 1 Connection between basic circuit element and its lead, such as the link between a semi-conductor chip and the lead frame. App Level 2 Is it a component that goes into a PCB? Does it connect a component to a PCB? Does it apply components to a PCB? Fig. 6 – Level 1 and 2 Connections Level 3: Circuit to Circuit—Usually connects PCBs within an assembly. The most common implementation is the connection between a motherboard and a perpendicular or parallel daughter board. Level 4: Subassembly to Subassembly—Connections between two subassemblies within a chassis. In this case, it is the first level where cabled connection is found and is typified by the connection between an internal power supply and a circuit board in a chassis. App Level 4 Is it a component of a subsystem? Is it a subsystem or subassembly? Does it connect two subsystems together? App Level 3 Does it connect PCBs to each other? Does it apply PCB connectors to a PCB Fig. 7 – Level 3 and 4 Connection Level 5: Subassembly I/O—Connections between a subassembly(ies) and chassis I/O. This particular level almost always terminates in a bulkhead-mounted connection. It serves as the I/O to a chassis and can be either power or data. 8