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TE Connectivity & Microchip Technology - Zonal Architecture: Delivering New Standards of Connectivity for Automotive and Beyond

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Rikard Andersson Senior Marketing Engineer, Automotive Products Group, Microchip Technologies Inc. Nils Braun Director Product Management, TE Connectivity Safwan Isap Senior Manager Product Management, TE Connectivity Learn More About Our Experts Rikard has over 20 years of experience in the Automotive sector with more than 10 of those years spent in the semiconductor industry. Rikard has been working for Microchip since 2012 in several roles and is currently covering the automotive distribution market as well as the Nordic/Baltics and UK & Ireland direct markets for Microchip's Automotive Product Group. Nils Braun leads TE Connectivity's Mixed & Hybrid Connectivity Portfolio for automotive applications. In his global role, he is responsible for the portfolio strategy and product defining roadmaps for modular signal, power, and data connectivity solutions for next-generation E/E architectures. Additionally, he has responsibility for TE's green portfolio, focusing on initiatives to develop a more sustainable automotive connectivity product design and manufacture. Safwan leads TE Connectivity's Americas Product Management team for Automotive Data Connectivity. He joined TE Connectivity in May 2022 with seven years prior automotive experience at Molex, Stoneridge, and Kyocera- AVX. Safwan started his career as a Category Manager at distributor RS Components in the UK and has spent time working in the UK, Japan, and US. 29 Zonal Architecture: Delivering New Standards of Connectivity for Automotive and Beyond

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