Automotive Connector Strategies and Solutions
for Space Saving
Page 11
TE AUTOMOTIVE /// White Paper | Automotive Connector Strategies and Solutions for Space Savings
LITESURF plating technology is the result of more than five years of research and development to inves-
tigate a tin-free plating that relieves the risk of whisker-induced failures and is suited to the high-stress
conditions of press-fit pin connections. LITESURF plating was developed to meet manufacturers' needs
for progressive miniaturization, reduced pin pitch, and a smaller connector footprint on PCBs.
As TE developed the LITESURF plating technology, more than 12 different deposit compositions were
researched, investigating whisker formation as well as other behavioral characteristics impacting produc-
tion processes such as melting temperatures. TE experts created a detailed matrix of all options. The TE
study concluded that the optimal deposit for plating was an electroplated Bismuth-based coating. Using
Bismuth has additional benefits, allowing manufacturers to use an application process that follows the
typical galvanic plating line procedure that is comparable to a standard tin bath. Bismuth-based LITE-
SURF plating can be implemented within existing plating lines without any additional process changes.
Extensive LITESURF plating tests were performed on more than 5,600 multi-spring and action pins and
on three different types of PCB technologies. Tests demonstrated that LITESURF plating can reduce the
risk of whisker incidence by a factor of over 1,600, based on the number and size of particles detected
combined with Bismuth's lower conductivity, which is 90 percent lower than tin's conductivity.
Figure 12. LITESURF anti-whisker plating composition
