Issue link: https://te.mouser.com/i/1349209
Automotive Connector Strategies and Solutions for Space Saving Page 10 TE AUTOMOTIVE /// White Paper | Automotive Connector Strategies and Solutions for Space Savings HOW OCEAN APPLICATOR 2.0 IMPROVES SMALL-WIRE CRIMPING The OCEAN Applicator 2.0 is the latest in TE's series of applicators, featuring several upgrades designed to improve small-wire crimping (smaller than 0.35 mm 2 ). General design advantages include an optimized anvil geometry, a pinned-base plate to prevent anvil misalignment, and a new black nitriding finish for significantly improved resistance to wear and tear (Figure 10). TE has developed features to aid small-wire crimping, which include easier feed adjustments and strip guide lock improvements. In addition to the new optimized anvil geometry, the OCEAN Applicator 2.0 features a new System 3 terminal hold-down mechanism to ensure accurate and stable terminal position- ing. It also provides a robust crimp height adjustment feature, as well as a locking mechanism. Manufacturers can perform quality control and verification of the automated crimping process via stan- dard crimp monitoring systems, which are also suitable for fine wires. In addition, the TE CrimpData App enables partners to conduct efficient wireless monitoring of the automated crimp processes, including monitoring of cycle numbers setting alarms to conduct maintenance and replace spare parts. TE's manual crimp tools deliver exactly the same crimp connection quality as automated wire termina- tion. In addition, the manual tool's good ergonomics enable it to be used within confined spaces. 12 | ANTI-WHISKER PRESS-FIT PIN PLATING The trend towards miniaturization also increases the industry's need for solutions that prevent metallic whisker formation. The increasing amount of electronics in vehicles has led component manufactur- ers to use press-fit technology for printed circuit board (PCB) con- nectivity as a reliable alternative to solder-based solutions. Plating is applied to press-fit pins to facilitate lubrication and protect against surface damage due to oxidization and other causes. Today, these plating solutions are comprised primarily of tin (Sn). However, tin has a high susceptibility to whisker growth. Tin whiskers can grow spontaneously from their root in hair-like formations when the tin film is stressed, such as when it is inserted into a PCB. Since tin whiskers are metal, they are electrically conductive and can grow long enough to bridge to other metal components. In extreme cases, they can short-circuit electronic operations. In the past, this problem was addressed by the inclusion of lead within plating. Lead has been phased out of manufacturing processes because it harms the environment. Since vehicle manufacturers are reducing pin-pitch distances and adopting pin-plating solutions that primarily consist of tin, they are seeking new alternatives to reduce the risk of tin whisker formation. INTRODUCING LITESURF PLATING – AN ENVIRONMENTALLY FRIENDLY ANTI-WHISKER PLATING FOR PRESS-FIT TE's LITESURF plating technology is an anti-whisker plating for press-fit applications. It provides auto- motive electronics manufacturers with an alternative to tin that has virtually no risk of whisker growth. Based on bismuth (Bi), it is environmentally sustainable and totally harmless. Figure 11. Tin whisker growing from a Press-Fit pin