Issue link: https://te.mouser.com/i/1472768
AEROSPACE / WHITE PAPER CONNECTING THE FUTURE OF FLIGHT 2 It's valuable for avionics system designers and EWIS engineers to view interconnects holistically as part of a system where EVERY CONNECTION COUNTS. As eVTOL aircraft designs rapidly iterate and proliferate, project teams encounter a wide range of connectivity challenges (Figure 1 on page 3). Areas covered in this white paper include: • Network solutions, which encompass cabling and connectors, wiring harnesses, and terminations that transmit data and signals. Different protocols, topologies, and bus types are used depending on the avionics application, such as inflight- entertainment and communication (IFC), cabin environment control, navigation, and flight-management-and-control systems. • Architectures/electronic packaging levels, which in this white paper covers Level 2 printed circuit boards (PCB), Level 3 board assemblies, Level 4 modules and assemblies integrated into an enclosure, Level 5 subsystems connected with a system's input/output (I/O) interface, and Level 6 network connections from box to box. • Sensor fusion, which encompasses various radio frequency (RF) and electro-optical sensor technologies that provide inputs integrated with radar and signal processing along with other I/O from sensor nodes and networks. • Standards, which include aviation-specific Aeronautical Radio, Inc. (ARINC) standards, Society of Automotive Engineers (SAE) aerospace standards (AS), network communication standards (e.g., Ethernet IEEE 802 and serial CANbus standards), and even military specifications (MIL-SPEC). In recent years, connectivity products have been introduced that are defined by new or emerging standards alongside commercial- off-the-shelf (COTS) technologies suitable for electric flight. EXPLORE THE PAPER: CHALLENGES ARCHITECTURE SENSORS IMPLEMENTATION OPPORTUNITIES NETWORK 2. Scope of Challenges