TE - White Papers

15 AEROSPACE / WHITE PAPER CONNECTING THE FUTURE OF FLIGHT MiniMRP Modules By supporting miniaturized, standardized modules that can be mixed and matched within a high-speed network, a TE MiniMRP solution provides the flexibility that UAM avionics designers and airframers need for avionics placement and cabling. Flexibility ARINC 836A MiniMRP modules from TE are available in four compact size combinations: single-width (42 mm/1.6 inches) or dou- ble-width (84 mm/3.3 inches), and single-height (112.3 mm/4.4 inches) or double-height (224.8 mm/8.8 inches) variations. Lightweight com- posite materials replace traditional heavy metal enclosures. Advanced composite formulations — including base materials and fillers — can be selected to meet application needs. Fillers range from carbon fibers to microsphere and nano- tubes. Composites can be selectively plated to add shielding, circuit elements, and other features, such as embedded antennas. Previous- ly considered expensive, composite enclosures are now more cost-effective thanks to advanced manufacturing techniques. Configuration With MiniMRP avionics, a big box in the avion- ics bay can be replaced with small enclosures distributed on a fiber optic or copper backbone (Figure 8). Modules can be used singly or combined as needed for specific functionality and external environmental factors. MiniMRP packaging encompasses connecting hardware, including bus-structured modules, interfaces, and power supplies. Standardization allows designers to take advantage of COTS components to lower costs and accelerate the design cycle. Modules are designed for quick, tool-less installation. Changes, maintenance, and upgrades can be accomplished by simply swapping out modules. Rack Interconnects Avionics designers often face tight constraints with PCBs; modular racks provide design flex- ibility using European Standard EN4165-mate- able interconnects for modular racks. With a fully-integrated MiniMRP design, PCB connector modules and boxes can be securely latched to protect against pull-out and torsion. The preferred connector for MiniMRP modules is the classic DEUTSCH DMC-M series connector that conforms to demanding avionics specifi- cations, including EN4165. The DMC-M family offers many contact arrangements and insert layouts in both multi-cavity and single-module configurations. Sizes include 8, 12, 16, 20, and 22 gauges. Contacts can be crimped on copper wire, aluminum wire, or PCB mounting. TE TECHNOLOGIES FOR IMA FIG 8: MiniMRP modules, standardized in ARINC 836A and conforming to IMA packaging, are distributed on a fiber or copper backbone. (Courtesy TE Connectivity)

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