Issue link: https://te.mouser.com/i/1349122
Car Connectivity based on Automotive Ethernet MATEnet interconnection system provides bandwidth, flexibility and reliability Page 8 Car Connectivity based on Automotive Ethernet MATEnet interconnection system provides bandwidth, flexibility and reliability TE AUTOMOTIVE /// White Paper | Car Connectivity based on Automotive Ethernet (NanoMQS terminals; for more details cf. chapter 5) and has successfully passed severe testing and vali- dation at the TE Bensheim testing facility (near Frankfurt). During this testing phase MATEnet has not only demonstrated the 1 Gbps performance of 1000BASE-T1 specifications (Fig. 2) but has also demonstrated future potential for 5 Gbps (with alternative technologies). MATEnet is a comprehensive end-to-end interconnection platform solution that offers many benefits: It is a modular and scalable system which uses a core module based on a standardized NanoMQS terminal/ housing and can be used in different configurations like multiport or sealed/shielded applications. One particular benefit is MATEnet's capability to interconnect Twisted Pair (TP), Unshielded Twisted Pair (UTP) and Shielded Twisted Pair (STP) within one interconnection system. MATEnet supports the trend of in-vehicle network links as a cost efficient solution for distributing net- working architecture with mid-size data volumes and low latencies and can be used for ADAS sensors, 360° camera systems, telematics units (data traffic to the head unit), onboard diagnostics, infotainment applications in the dashboard and domain architecture applications. The scope of TE Connectivity expertise that has gone into developing MATEnet spans connector design, Including worst case tolerance analysis along with cable definitions, in-depth signal integrity analysis with respective board level design and EMC, the needed processing development for cable termination and finally the system testing with TE's end customers. TE is also active in the Technical Committees for TC 2 (100 Mbps) and TC 9 (1 Gbps) and has harnessed its expertise stemming from the previous committee discussions. The interconnection system is currently (2017) in its B sample phase. The SOP will be in 2018. All major chip makers have been provided with samples 4.1 | THE UNDERLYING APPROACH TO MATENET High-frequency, high-bandwidth data transfer poses strict require- ments to signal integrity. The effort and cost required to fulfill individual Automotive Ethernet application needs is typically a product of measures which are integrated in the chip and the effort that goes into the channel (cable and connectors). MATEnet was designed to offer an opti- mum balance between both cost curves (Fig. 3). MATEnet delivers an excellent cost-performance ratio because it neither places a high burden on chip capabilities (size, power consumption) nor does it require high-end cabling (materials, pro- cesses, complexity). To offer this balance, TE Connectivity has specified suitable round cables together with a cable vendor. Fig. 3: MATEnet is designed to deliver the optimum cost balance between chip and channel efforts