Issue link: https://te.mouser.com/i/1349092
TE Connectivity Trend Paper /// Connectivity for Next-Generation Mobility Page 11 Connectivity for Next-Generation Mobility fields, high-voltage high power lines, and devices. In addition, it creates no electromagnetic emissions or cross- talk with neighboring data lines or wireless communication systems. However, it should be noted that electronics themselves, with sharp driver currents for the diodes, do create emissions that may not be easy to shield. A key advantage of fiber optic ca- bles is the low signal attenuation per meter. In addition, they are indepen- dent from signal-frequency attenu- ation meaning that the link length is not limited by the data rate of the signal. The loss per meter is lower than other link types. Depending on materials (core and cladding) as well as data transmission wavelength, fi- ber optics used for data transmission can have less than 0.2dB/m attenu- ation for plastic fiber (POF) based on light from red LEDs (650nm). For multimode glass fiber cables, the at- tenuation is in the range of 3dB per kilometer (~0.003dB/m). Although optical fiber may seem like an obvious solution for data connec- tivity in a high-power all-electric en- vironment, it does have some restric- tions. Glass optical fibers are limited in terms of bend radius and are not as resistant to levels of vibration found in an automotive environment. Plastic optical fiber is a more cost-ef- fective option than glass and is more resilient, but it supports lower band- width and shorter distances and also requires more expensive optical transceivers for high data-rate ap- plications (e.g. 1 Gbps). In addition, optical fiber, in general, does not en- able the transmission of power and hence is not suited for space saving hybrid links. Looking ahead, plastic optical fiber is likely to be a viable solution for 1 Gbps Ethernet links in Automotive. Today the standardization body for Ethernet (IEEE) has issued specifica- tions for Gigabit Ethernet over plas- tic fiber (1000BASE-RHC) or also known GEPOF. TE Connectivity provides solutions that meet EMC standards and test specifications based on all of the above methods. These include ISO 11452 and CISPR 25. Let's take a clos- er look at some examples. 4.3.2.1 MATE-AX TE's FAKRA compliant MATE-AX connector families offer solutions that can be used for safety links with high RF-requirements. The MATE-AX connector is designed for data rate performance of up to 9GHz and up to 20GHz with opti- mized designs and reduces space to meet today's automotive packaging requirements. Its electrical perfor- mance meets link segment, compo- nent-level signal integrity, and EMI requirements. The robust and com- pact MATE-AX connector is available in different configurations to meet different environmental conditions. In addition, MATE-AX connectors are developed to fit seamlessly into the existing cable assembly processes, such as the well-established FAKRA compliant-crimping processes. 4.3.2.2 MATEnet MATEnet is TE's modular and scal- able differential connector platform. It was developed for upcoming dis- tributed network vehicle architec- tures which require fast and reliable connectivity solutions. The new system has been proven to meet Ethernet data transmission require- ments according to 100BASE-T1 and 1000BASE-T1. In addition, MATEnet has the poten- tial to support data rates up to 6Gbps because it uses existing higher mod- ulated data transmission technolo- gies. The 100BASE-T1 UTP variant offers complete EMI protection. However, a shielded (STP) variant of- fers full control of EMI for certain ap- plications using 1000BASE-T1, such as a link is located in close proximity to radio antennas. In these cases, the shielded version would ensure the in- tegrity of the FM signal. TE is also developing a differential connector with a complete 360° shielding interface that will support data rates up to 20Gbps. 4.3.2.3 TE's Next-Generation Automotive Data Connectors TE Connectivity provides solutions that meet the most relevant EMC standards and test specifications, including ISO 11452 and CISPR 25. Although current data cables meet these standards, they continue to be challenged by ever greater