Other content in this Stream
Power Connector Protection in a Rack Scale Architecture
Power connectors can become a point of failure if exposed to any of several detrimental conditions. Most of these conditions are monitored and/or well controlled by the datacenter.
V2X Ecosystems and Automotive Autonomy
Nearly 10 years in the making, widespread 5G adoption is unlocking new opportunities in decades- and even centuries-old industries.
Thermal Bridge for Improved Thermal Management
TE Connectivity demonstrates the new thermal bridge technology for efficiently transferring heat across a gap of variable size, while controlling the force applied to surrounding components.
Cabled Backplane Systems The High-Speed Alternative to PCBs
TE Connectivity (TE) delivers cabled backplane products that provide maximum flexibility and throughput with exceptional signal integrity.
CTO Insight on Cloud Computing
TE Connectivity (TE) CTO & VP Erin Byrne discusses her perspectives on Cloud Computing and megatrends influencing design architecture.
Tech Talk - Future Proofing Data Centers
Join Nathan Tracy, Technologist for System Architecture as he hosts a distinguished panel of experts from TE Connectivity to discuss next generation data centers.
DesignCon 2020 - 112G STRADA Whisper Backplane Connections
Justin Pickel demonstrates the new STRADA Whisper Absolute orthogonal link with 112 Gbps PAM4 electrical signaling running over a +30dB channel with crosstalk aggressors
800G QSFP-DD Active Copper Cable
The 800G QSFP-DD active copper cable (ACC) demonstrates the latest in TE’s bulk cable and termination technology.
Cabled Card Electromechanical (CEM) Technology
TE uses a standardized CEM connector interface, defined within the PCI-SIG standard, in tandem with a Sliver 4C+ host connector.
Co-Packaged Socket Technology
TE has developed socket technologies to allow contact pitches down to 0.40mm while delivering excellent signal integrity performance.
Data Center Connectivity: From IEC Standards to Power Protection
Using the same standards when building data centers makes installation and repairs easier for engineers and more efficient and cost-effective – in the long run – for owners.
Next Generation PCIe Link with CDFP Technology
TE’s CDFP technology connects computing appliance resources within applications such as Artificial Intelligence/Machine Learning and NVMe-based storage applications.
DDR5 DIMM SOCKET
TE’s fifth generation of double data rate, dual inline memory module (DDR5) sockets include surface mount technology and can address the higher data rates needed for today’s memory module applications
Solving Thermal Performance in Data Centers
Demand for increased computing power is driving higher-power data racks and more efficient data centers.
Machine Learning in Data Center Architectures
The data center’s infrastructure can be the key to enabling the IT architecture’s functionality since most of its content is passed through or sourced by the IT architecture.